Ο/H Phone Arena News έγραψε:

Earlier today we told you that the chipset expected to be found inside the Huawei Mate 9, the Kirin 960, will be unveiled on October 19th. This is a chip that is designed by Huawei and produced by a third party manufacturer like TSMC. Besides the date that the Kirin 960 will be announced, some other interesting new rumors popped up today regarding the next phone in the Mate series.

First, there is speculation that the Mate 9 will feature a dual camera setup in back. Like the rear cameras on the Huawei P9, the optics on the Mate 9 will be manufactured by Leica. One camera is expected to ...